1 / 4 www.asb.co.kr october 2009 p lerow tm apm0400 - p33 low noise & high oip3 medium power ampl i fier module specifications parameter unit min typ max frequency range mhz 380 420 gain db 18 19 gain flatness db ? 0.7 ? 0.8 noise figure db 10 11 output ip3 (1) dbm 44 47 s11/s22 (2) db - 10/ - 12 output p1db dbm 32 33 switc hing time (3) ? sec - supply current ma 600 700 supply voltage v 5.4 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 13wx13lx3.8h operating temperature is C 40 ? c to +85 ? c. 1) o ip3 is measured with two tones at an output power of 18 dbm/tone separated by 1 mhz. 2) s11, s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level af ter swi tching dc voltage from 0 v to v s . pin number function 3 rf in 8 rf out 10 v s other s ground feature s note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of a ll ground pins for better rf and thermal perfor m ance, as shown in the dra w ing at the left side. description s 21 = 19.7 db@380 mhz = 18.3 db@420 mhz nf fo 10.0 db over frequency unconditionally stable single 5.4 v supply high oip3@low current website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 asb inc., 4th fl. venture town bldg., 367 - 17 goijeong - dong, seo - gu, daejon 302 - 716, korea more inform a tion 2 - stage single type typ.@t = 25 ? c, v s = 5.4 v, freq. = 400 mhz, z o.sys = 50 ohms specifications (in pr o duction) apm0400 - p33 asb inc. solder stencil area ? 0.3 plated thru holes to ground plane plerow (top view) (bottom view) (side view) 2 x ? 2.0 plated thru holes to screw on heat sinker (recommended footprint) ou t line drawing (unit: mm) apm0400 - p33 is an internally matched amplifier mini - module for such application band in smd pac k age with the output p1db of 33 dbm. it is compactly d e- signed for low current consumption and high oip3. integrating all the components for biasing and matc h- ing within the module enhances production yield and throughput as well. it passes through the stringent dc, rf, and reliability tests. not sample test but 100% quality control test is made before packing .
2 / 4 www.asb.co.kr october 2009 p lerow tm apm0400 - p33 low noise & high oip3 medium power ampl i fier module s - parameters oip3 @380mhz oip3@400mhz 380 ~ 420 +5 .4 v s - parameters & k factor typical performance (measured) noise figure
3 / 4 www.asb.co.kr october 2009 p lerow tm apm0400 - p33 low noise & high oip3 medium power ampl i fier module oip3 @420mhz p1db pout vs pin@400mhz -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 18 0 5 10 15 20 25 30 35 40 pout (dbm) pin (dbm) current vs pin@400mhz -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 18 0 200 400 600 800 1000 1200 1400 current (ma) pin (dbm)
4 / 4 www.asb.co.kr october 2009 p lerow tm apm0400 - p33 low noise & high oip3 medium power ampl i fier module 1) the tantal or mlc (multi layer ceramic) ca pacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are i n- cluded inside the apm module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the applicat ion fr e quency. application circuit recommended soldering reflow process 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) + - apm out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor in out vs evaluation board layout size 40x40 mm (for apm series C 13x13 mm)
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